Shield and heat sink is an important part of devices which generate a lot of heat during operation especially most electrical and electronics devices. JCL being a leading sheet metal fabricator, provides high quality, accurate design, and high performing Shields & metal heat sinks.
Shields are pieces of steel or aluminum design and developed for specific electric circuit boards. These shields are designed and developed to protect electronic circuits from external factors including EMF.
There is no specific type or shields. JCL divides them into single piece and two piece board level shields. JCL sheet metal fabrication manufacturer is skilled and dedicated to deliver high quality board level shields. JCL delivers board level steel shield and board level aluminum shield.
All electrical and electronics circuits are not designed to dissipate heat, they need external assistance to remove heat they produce during operation. Metal heat sinks provide electronic devices a dedicated and extended surface area that help them dissipate heat effectively.
A heat sink consists of a base and fins. Base is attached to the heat source and fins are used to dissipate heat into the environment. In most heat sinks, the base and fins are of the same material and are fabricated from a single piece of material. Base is flat in shape and fins are made thin, perpendicular to the base and can be of any shape.
JCL is fully capable of fabricating and delivering a heat sink of any material but most clients ask for Aluminum heat sink and copper heat sink.
Aluminum heat sink by aluminium deep drawing has the ability to dissipate heat through conduction at the rate of 235 watts per kelvin per meter. Aluminum heat sinks are very lightweight, have high corrosion resistance and are very cost effective.
Copper heat sink by copper deep drawing has the ability to dissipate heat through conduction at the rate of 400 watts per kelvin per meter. Copper heat sinks are high end heat sinks, have high corrosion resistance and are used in critical devices.
JCL has a fully established setup to deliver stamped board level shields and heat sinks. These stamped board level shields and heat sinks are mostly used in electrical and electronic circuits for shielding and dispensing heat.
Stamp board level shield and stamped board level heat sinks are fabricated from custom sheet metal forming through progressive punching methods. Each punch during the process adds a certain feature on the shield or heat sink. To add different features, dies of the shape of the features are used.
Dimensions and design of stamped board level shield and board level heat sink depends on the product they will be used for. These heat sinks can be an active or passive type of heat exchanger depending on the quantity of the heat they need to dissipate.
Sheet metal stamping the board level shields and heat sinks with JCL stamping and forming, offers following benefits.
Shield and heat sinks will be ideal for low power applications. These shield and heat sinks will be most cost efficient for application below 5 Watt.
These shield and heat sinks ensure fast and very easy assembly onto the electric board.
JCL stamping process offers very high production speed and is suitable for all types of production volume.
JCL stamping process is cost effective for each and very batch size and production volume.
Extruded aluminum heat sinks are one of the most used heat sinks from medium to large side heat dissipating products. These heat sinks can be used for medium to high electrical power applications.
Extruded heat sinks can be used as active and passive heat exchangers based on the fin size and shape. These extruded aluminum heat sinks by aluminium deep drawing are common for FPGA and BGA. Designing an extruded heat sink depends on the profile needed for the specific product.
Extrusion of a heat sink is done by creating a set of dies. The die has a profile according to the profile of the heat sink needed. Some design parameters needed for this include fins number, pitch and length with base height and width.
Best for medium to high power applications
Process is fast and deliver high production rate
Excellent material utilization with very low waste
Very cost effective process for high volume production
Very to customize the heat sink for custom need
In these types of heat exchangers the fins are usually fabricated separately first and then bonded or brazed onto the heat sink base. Fin fabrication depending on the design can be done using extrusion, sheet metal cutting services or any other specific process. Base is usually extruded to have cuts ready for fins to attach.
The bonding materials used to attach fins with base is usually a conductive bonding material. It can be epoxy or soldering. Bonded and brazed heat sinks offer a better performance due more surface area which is due to higher number and longer fins.
These heat sinks usually have small size for applications that have limited space
Custom material selection for fins, different from base material offer high thermal performance
Custom fin design enable excellent forced convection with no limit on air flow length
These heat sinks offer tight fin pitch
These heat sinks offer high fin aspect ratio
These can be very easily integrated and they have very high design flexibility
Due to separate fabrication of fins these heat sinks have lower tooling costs
Choose JCL for fabrication of top sheet metal Shields and Heat Sinks. Known for its customized solutions. With expertise in this fabrication industry JCL crafts Shields and Heat Sinks from high quality materials like steel, aluminum and copper. With a focus on robust design and comprehensive fabrication processes. JCL ensures that each client receives a tailored solution that excels in performance and durability.
We are excited to collaborate with you!
If you have any questions about our products or require custom machining services, please don’t hesitate to reach out to us. We are here to assist you and provide the solutions you need.
